Aging Degradation of Ni and NiCr-Ni Thin Film Conductor Systems

Young’s modulus of electroplated Ni thin film for MEMS applications

The Young’s modulus of an electroplated nickel (Ni) thin film suitable for microelectromechanical applications has been investigated as a function of process variables: the plating temperature and current density. It was found that the Young’s modulus is approximately 205 GPa at plating temperatures less than 60 jC, close to that of bulk Ni, but drastically drops to approximately 100 GPa at 80 ...

Characterization of Pd-ni Thin Film by Annealing Method

Thin film electrode production and characterization for heat cell studies are described. The objective is two-fold: maximizing excess heat production and insuring a long lifetime and electrolysis. To do this in a reproducible faction, a pre-and post-run analysis of the films was carried out using various probe techniques. In this study, various Pd-Ni thin films were manufactured using with a ma...

Thick Film Ni-Ferrite Inductors

Industrial Cu-Ni alloys for HTS coated conductor tape

Copper rich Cu-Ni alloys have been textured with the RABiTS method in order to get non-magnetic and cost efficient substrates for coated conductor wires. The study is focused on two industrial compositions: Cu55Ni45 (Constantan) and Cu70Ni30. Studies on surface roughness have been done. The effects of annealing conditions (temperature and atmosphere) on the grain boundaries deepness were analyz...

Ballistic magnetoresistance in a nanocontact between a Ni cluster and a magnetic thin film

We present measurements of ballistic magnetoresistance in nanocontacts grown by electrodeposition of Ni microclusters on magnetic thin films covered by aluminum oxide layers, using a technique proposed by Schad et al. @D. Allen, R. Schad, G. Zangari, I. Zana, D. Yang, M. C. Tondra, and D. Wang, J. Vac. Sci. Technol. A. 18, 1830 ~2000!; Appl. Phys. Lett. 76, 407 ~2000!; D. Allen, R. Schad, G. Za...